Samsung and Broadcom Team Up with Over $200 Billion Investment, Fully Betting on Next-Generation AI Chips
Samsung and Broadcom have reached a long-term deep cooperation, covering the entire supply chain of memory chips, foundry, and advanced packaging. It is expected that by 2030, the scale of cooperation will break through $200 billion, marking that AI chips have entered a stage of 'design plus manufacturing' deep integration. The core technology is Broadcom's ASIC custom design capabilities combined with Samsung's manufacturing. The two companies will jointly tackle challenges in sub-2nm process technology and HBM high-bandwidth memory fields.